Sensor assembly and method for producing a sensor arrangement

There is a sensor arrangement, in particular a pressure sensor assembly, comprising a a main plane having substrate and a substantially oriented parallel to the main plane of the sensor element, wherein the substrate comprises a ceramic material, said substrate having at least one strip conductor and the sensor element in a first contact area by means of flip chip technology electrically conductively connected to the one conductor track is connected to at least and further wherein the sensor element is mechanically connected in a second area of ​​contact with the substrate, an anodic bonding is provided in the second contact area.