Two types of MeV ion beam enhanced adhesion for Au films in SiO2

The ion beam-enhanced adhesion of thin Au films on vitreous silica substrates was studied for a wide range of Cl ion beam doses for beam energies between 6.5 MeV and 21.0 MeV. Since the residual adhesion of Au on SiO_2 is low, the improved adhesion can be easily seen using the Scotch Tape Test. The threshold in the enhanced adhesion corresponding to passing the tape test occurs at two different dose ranges for a given energy; one at very low dose centered around 1 × 10^(13) /cm^2, the other at higher doses with a threshold of around 1.5 × 10^(14) /cm^2 (depending upon the beam energy). At low doses (2 × 10^(12) to 5 × 10^(13) /cm^2) surface cracks occur on the SiO_2 substrates, these cracks close up at doses higher than 5 × 10^(13) /cm^2. A possible explanation of enhanced adhesion in the low dose range is associated with the surface crazing of the SiO_2 substrate. To make the adhesion test more quantitative, a scratch test was also used on the samples.