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Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technology with 3D Redundancy Scheme
2021
Shinji Sugatani
Norio Chujo
Koji Sakui
Hiroyuki Ryoson
Tomoji Nakamura
Takayuki Ohba
Keywords:
Scheme (programming language)
Redundancy (engineering)
Wafer
Computer science
Cube
Computer hardware
Correction
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