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Reactive diffusion bonding of Si3N4 to MA6000
Reactive diffusion bonding of Si3N4 to MA6000
1991
Wolfgang A. Kaysser
Alan M. Frisch
William Zhang
Gunter Petzow
Keywords:
Thermal expansion
Silicon nitride
Scanning electron microscope
Stress (mechanics)
Diffusion bonding
Residual stress
Thermomechanical analysis
Stress relaxation
Composite material
Materials science
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