Untersttzung von Kreativittssitzungen an einem Tabletop-System

A method of post-processing a solid-state imaging device including a wafer processing step 1 (S1), an assembly step 2 (S2) in which packaging is performed, an inspection step 3 (S3), and an annealing step (S4) in which a solid-state having gone through the inspection step 3 is annealed at a predetermined temperature. The method makes it possible to reduce the level of an image defect that occurs after assembly.