Dicing die bonding film and method for forming groove in dicing die bonding film

The present invention relates to a dicing die bonding film in which separation between an adhesion layer and a ring frame is prevented to improve processability, and more particularly, to a dicing die bonding film in which a groove is formed in an attachment area of an adhesion layer attached to a ring frame to prevent an adhesion force from being weakened between a film and the ring frame, and prevent the film and the ring frame from being separated from each other by removing the water and/or air injected during a semiconductor manufacturing process through the groove.