Manufacturing method and a semiconductor element of a semiconductor device

The method of manufacturing a semiconductor device (10) includes a semiconductor element forming step of forming a semiconductor device (10) comprising a dielectric film (3), a dielectric film in the partitioned regions for partitioning the semiconductor element (10) and (3) including a dicing region forming step of forming a dicing region (11) is removed, a dicing step of dicing the dicing region (11), the.