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Properties of Lead-free Solder Joints on Flexible Substrate for Automotive Electronics
Properties of Lead-free Solder Joints on Flexible Substrate for Automotive Electronics
2018
Sungdo Ahn
Kyeonggon Choi
Dae-Young Park
Gyu-Won Jeong
Seungju Baek
Yong-Ho Ko
Keywords:
Automotive electronics
Mechanical engineering
Soldering
Substrate (chemistry)
Materials science
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