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3D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabrication
3D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabrication
2010
Sébastien Lani
Michael Canonica
Dara Bayat
Caglar Ataman
Wilfried Noell
Nico F. de Rooij
Keywords:
Eutectic system
Composite material
Structural engineering
Wafer
Materials science
Fabrication
Optoelectronics
Correction
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