Old Web
English
Sign In
Acemap
>
Paper
>
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
2020
Eom Yong Sung
Choi Kwang-Seong
Gwang-Mun Choi
Jang Ki Seok
Jiho Joo
Lee Chanmi
Moon Seok-Hwan
문종태
Keywords:
Epoxy
Integrated circuit packaging
Interconnection
Nanotechnology
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]