Development and fabrication of a thermally enhanced WLFO demonstrator

The leading Fan-Out Wafer-Level Packaging (FOWLP) technology, WLFO by NANIUM, stemmed from Infineon's/Intel's embedded Wafer-Level BGA (eWLB) technology, has limited heat dissipation capability, as the materials used in, namely the epoxy mold compound (EMC), originally aimed process ability and mechanical stability, but not heat conduction. As WLFO technology expands to WLSiP (Wafer-Level System-in-Package) for very high density system integration, combining multiple chips and different components in the same package, the thermal performance becomes a critical factor. In a broader scope, improving the heat dissipation capabilities opens WLFO technology platform also to power applications.