MEMS high-vacuum packaging structure based on getter

The invention provides an MEMS high-vacuum packaging structure based on a getter. The MEMS high-vacuum packaging structure comprises the components of a packaging chamber, an MEMS device and the getter, wherein the MEMS device and the getter are arranged in the chamber. The packaging chamber comprises a packaging substrate and a packaging cover plate. The packaging substrate and the packaging cover plate is provided with a supporting device which is used for supporting the getter so that the getter is suspended in the chamber and does not contact with the inner surface of the packaging chamber. The MEMS high-vacuum packaging structure is provided with the packaging chamber for the supporting device. When the getter is heated and activated in a vacuum environment, heat transfer can be effectively reduced, thereby preventing transmission of a large-amount of generated heat to an IC/MEMS device through the packaging substrate or the packaging cover plate, and preventing adverse effect to the IC/MEMS device. More importantly, activation efficiency and success rate of the getter can be improved. Furthermore packaging structure discard caused by getter activation failure is reduced.