Laser processing device of silicon glass bonding slice and method thereof

The present invention relates to silicon - a laser processing apparatus and method for bonding a glass sheet, the high frequency output of ultraviolet ultrashort pulsed laser light shutter arrangement, the beam expander and the aperture stop, the aperture stop is disposed with a pair of output terminals 45 degrees the total reflection mirror, the total reflection mirror output terminal 45 of the deflection lens arrangement, a deflection lens is arranged the output end of the total reflection mirror 45, an output terminal of the total reflection mirror 45 of the focusing arrangement focusing mirror positive three-dimensional mobile platform, arrangement is mounted above the CCD lights dimensional CCD mobile platform coaxial alignment observation system below focusing mirror. High-frequency ultrashort pulse ultraviolet beam emitted from the laser via the focusing optical focus on the glass on the surface of the material being processed, the deflection mirror control a helical cut dicing lane width to prepare a suitable cutting track width, precise positioning of the cutting scribe, focus control with increasing depth of cut and a corresponding decrease sequentially silicon - scribe lines to be cut on the sheet glass bonding.