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A Thermally Robust Ti-Rich TiNx Contact Metallization Realizing an Interconnect System Suitable to 0.10-μm DRAMs and Beyond
A Thermally Robust Ti-Rich TiNx Contact Metallization Realizing an Interconnect System Suitable to 0.10-μm DRAMs and Beyond
2001
Isamu Asano
Yoshitaka Nakamura
Hideo Aoki
Naoki Fukuda
Satoru Yamada
Toshihiro Sekiguchi
Keywords:
Nanotechnology
Electronic engineering
Materials science
Interconnection
Dram
Correction
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