Method for stripping flexible substrate

The invention discloses a method for stripping a flexible substrate. The method comprises the following steps: A, forming a non-crystalline release layer on a hard substrate, wherein the release layer is made of a material which can form flaky crystalline after being heated; B, forming a flexible substrate on the release layer; C, manufacturing an electronic or optical device on the flexible substrate; and D, heating the release layer to transform the release layer into a layered structure which is easy to strip, and stripping the flexible substrate from the hard substrate. According to the method for stripping a flexible substrate of the invention, the characteristic of the release layer material, namely, the material forms flaky crystalline after being heated, is utilized, the release layer is transformed into a layered structure which is easy to strip through heating after the electronic or optical device is manufactured on the flexible substrate, and thus the flexible substrate can be stripped from the hard substrate very easily and conveniently. The method of the invention does not require large equipment, and is simple in implementation and easy in operation.