3D-CSP: an innovative packaging method based on RMPD

A major bottleneck in the applications of microtechnologies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size- Packaging), which is based on RMPDTM, solves an extremely wide range of packaging problems. RMPDTM and 3D-CSP are discussed and applications presented.© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.