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Delamination Behavior Along Interface between Submicron Thick Polymer Film and Substrate under Creep
Delamination Behavior Along Interface between Submicron Thick Polymer Film and Substrate under Creep
2016
Emi Kawai
Takashi Sumigawa
Takayuki Kitamura
Keywords:
Metallurgy
Polymer
Composite material
Materials science
Delamination
Substrate (chemistry)
Creep
Correction
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