Photosensitive resin composition, cured film formed therefrom, and device having cured film

A positive type photosensitive resin composition containing: (A) a siloxane compound represented by chemical formula 1 below; (B) a quinone diazide compound; and (C) a solvent: [chemical formula 1] (R 1 R 2 SiO 2/2 ) D (R 3 SiO 3/2 ) T1 (SiO 3/2 -Y-SiO 3/2 ) T2 , wherein, in chemical formula 1, the definitions of R 1 to R 3 , Y, D, T1, and T2 are as described in the description of the invention.