Imprint-Through Mold Via (i-TMV) with Highly-Effective Electromagnetic Interference Shielding for RF devices

This work presents the imprint-thorough mold via (i-TMV) concept applicable for compartmental level electromagnetic interference (EMI) shielding. The i-TMV structure could be successfully fabricated by imprinting with the silicon master and filling with the conductive paste. We have fabricated a daisy-chained i-TMV test vehicle and it showed good connectivity. In order to study the EMI shielding properties, the electric field simulation was performed. Single and triple-array structures were modeled based on the fabricated test vehicle, and compared with the structure without via array. The result showed that the i-TMV could provide excellent EMI shielding.