Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging
2013
Abstract In this study, we incorporated micro-silver flakes and nano-hexagonal boron nitride (BN) particles into a matrix resin to prepare electrically conductive adhesives (ECAs). The humid and thermal aging results under a constant relative humidity level of 85% at 85 °C revealed that the aged ECAs containing 3 wt% of nano-hexagonal BN particles had high reliability. The contact resistance was low and the shear strength high. Nano-hexagonal BN particles have a good effect on the reliability of ECAs that can be used to improve the properties of ECAs.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
52
References
32
Citations
NaN
KQI