Method and device for controlling operation using temperature deviation in multi-chip package

Using a temperature difference in a multi-chip package is disclosed a method and apparatus for operation control. A second die which does not include the first die and a temperature sensor including a multi-chip package, the temperature sensor is deposited. A first die on the basis of the n-bit information temperature of the temperature sensor generates a temperature difference information of the m (m through the through-silicon electrode for temperature variation information of m bits, instead of the temperature information of n bits (TSVs). The second die controls an internal operation using the temperature difference information of the first die.