Evaluation of alternative cleaners for solder flux and mold release removal

As part of a solvent substitution program, an evaluation of selected alternative cleaners for solder flux and mold release removal has been performed. Six cleaners were evaluated for their efficiency in removing a rosin mildly activated flux and a silicone mold release from copper, 17-4PH stainless steel, polyimide quartz glass and tin-lead surfaces. A parallel effort also studied deionized water removal of organic acid fluxes. Auger electron spectroscopy and X-ray photoelectron spectroscopy were used to determine relative elemental cleanliness of the outermost atomic layers. An Omega Meter Test was used to measure residual ionic contamination. Water drop contact angles were used to measure the effectiveness of silicone removal from Cu substrates. In most cases, the cleanliness levels were good to excellent. 10 refs., 8 figs., 19 tabs.