Interlayer MEMS RF switch for 3D MMICS

A novel interlayer micromachined capacitive microwave switch sandwiched between two polyimide layers and two ground planes was designed and fabricated. The switch structure and the coplanar waveguide in the switch region were optimized for low insertion loss in the "on" state and high return loss and high isolation in the "off" state while satisfying other restraint conditions. Four serpentine beams were connected to the switch capacitance plate to reduce the actuation voltage.