Research on Transmission Performance of New Coplanar Waveguide Transmission Line Based on TSV Array Grounding

Three dimensional integrated circuit (3D IC) based on through-silicon-via (TSV) is gaining significant importance in semiconductor industry. For the three dimensional integration of microsystems, the TSV transmission structure of the passive integrated silicon-based adapter board achieves low-loss transmission requirements. A grounded Coplanar Waveguide (GCPW) structure with TSV array ground and a GCPW-TSV-GCPW structure for a silicon-based adapter board are proposed in this paper. The transmission performance is analyzed and optimized by considering the grounded TSV array, signal TSV and coplanar waveguide structure all together. In order to achieve lower loss transmission performance, an improved differential GCPW TSV-GCPW structure is proposed and analyzed as well. All aforementioned structural models are simulated and analyzed by HFSS in the frequency range of 0.1-30 GHz. The simulation results show that the insertion loss of the GCPW-TSV-GCPW structure is below −7.9dB. The insertion loss and return loss of the differential GCPW-TSV-GCPW structure are less than - 2.5dB and increased by 5dB, respectively. TSV structural parameter is also investigated to further understand how the TSV size makes impact on signal transmission performance.