Optimization of stepwise varying width microchannel heat sink for high heat flux applications

Abstract The semiconductor devices are widely employed for many applications. This pace of technology is significant sources of the heat which require to be cooled down properly to keep its performance stable. Additionally, under high operation temperatures, a physical damage is possible due to thermal stresses that threaten the safety components and increase the failure rate. The development in the direction of more tightly packed electronic devices increases the challenges of offering an efficient cooling for these devices under high heat fluxes in very restricted space. Hence, an advanced cooling technique is compulsory to attain the appropriate performance along with extending the lifespan of microelectronic. Stepwise varying microchannel width heat sink is considered one of the innovative cooling systems from microelectronic devices. In the current study, different designs of stepwise varying microchannel width heat sink were optimized, and their thermal performance was studied for microelectronics uniform.