Array technology for terahertz imaging
2012
Heterodyne terahertz (0.3 - 3THz) imaging systems are currently limited to single or a low number of pixels. Drastic
improvements in imaging sensitivity and speed can be achieved by replacing single pixel systems with an array of
detectors. This paper presents an array topology that is being developed at the Jet Propulsion Laboratory based on the
micromachining of silicon. This technique fabricates the array's package and waveguide components by plasma etching
of silicon, resulting in devices with precision surpassing that of current metal machining techniques. Using silicon
increases the versatility of the packaging, enabling a variety of orientations of circuitry within the device which increases
circuit density and design options. The design of a two-pixel transceiver utilizing a stacked architecture is presented that
achieves a pixel spacing of 10mm. By only allowing coupling from the top and bottom of the package the design can
readily be arrayed in two dimensions with a spacing of 10mm x 18mm.
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