Processing copper and silver matrix composites by electroless plating and hot pressing

A simple process was developed to fabricate ceramic-reinforced copper and silver matrix composites by electroless plating and hot pressing at 873 K and 300 MPa, in air. Composites were produced containing 10 to 40 vol pct ceramic reinforcements of different sizes and shapes including silicon carbide whiskers (SiC w ), alumina particles (Al2O3p ), carbon short fibers (Carbon sf ), and Saffil short fibers (Saffil sf ) (3.8 pct SiO2-96.2 pct Al2O3) uniformly distributed within the matrix. The hardness and bending strength of the composites were much higher than those of the pure matrices. The electrical conductivity, measured by a four-point probe method, was similar to that of traditional CdO/Ag electrical contact materials. The surface morphologies and cross-sectional microstructures of the arc-eroded Al2O3p /Ag composites were similar to those of conventional CdO/Ag and SnO2/Ag and exhibited a good arc-erosion resistance. These composites combine the high strength and elevated-temperature stability of the ceramic reinforcements with the good electrical and thermal conductivity of the two metallic matrices.