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A Highly Reliable Pure Al Metallization with Low Contact Resistance Utilizing Oxygen-Stuffed TiN Barrier Layer
A Highly Reliable Pure Al Metallization with Low Contact Resistance Utilizing Oxygen-Stuffed TiN Barrier Layer
1986
Iwabuchi
Shima.
Moriya
Maeda
Keywords:
Barrier layer
Oxygen
Contact resistance
Composite material
Tin
Materials science
Correction
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