Copper-clad laminates for heat-curable resin composition, a copper-clad laminate, and method for producing a copper-clad laminate

PROBLEM TO BE SOLVED: To provide a copper-clad laminate having excellent punchability and resistant to the generation of cracks in a thermal shock test. SOLUTION: The curable resin composition for a copper-clad laminate contains (A) a radically polymerizable liquid thermosetting monomer, (B) a radically polymerizable thermosetting resin, (C) a radical polymerization initiator, (D) an epoxy resin having two or more epoxy groups in one molecule, (E) a curing agent for curing the epoxy resin D, (F) an elastomer component and (G) an inorganic filler, wherein the elastomer component F contains (F1) a compatible elastomer miscible with the mixture of the components (A) to (E) and (F2) an incompatible elastomer which is immiscible with the mixture of the components (A) to (E). COPYRIGHT: (C)2008,JPO&INPIT