Highly integrated and solderless LTCC based C-Band T/R Module

HPA and Driver MMIC have been manufactured with PPH25X process from UMS whereas LNA and LLA have been developed using PH25 UMS process. The integrated Core-Chip has been manufactured using the ED02H OMMIC process. The full TRM has been realized in ISP (Integrated Substrate Package) technology based on Low Temperature Cofired Ceramic (LTCC) substrate to improve integration factor and have a reduction of the overall size.