Semiconductor module and method for testing a semiconductor-module

One aspect of the invention relates to a semiconductor module (100) with a temperature monitoring device (6). This has a first temperature (T1), while a first geometric shape. It is the designed such that when it is heated to a second temperature (T2) that is higher than the first temperature (T1) at the second temperature (T2) assumes different from the first geometric shape second geometric shape, and when the second temperature after heating (T2) is cooled to a third temperature (T3) that is lower than the second temperature (T2), to assume a different geometric shape from the first third geometric shape.