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Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
2018
Lei Shi
Lin Chen
David Wei Zhang
Evan Liu
Qiang Liu
Ching-I Chen
Keywords:
Electronic engineering
Chip-scale package
Epoxy
Wafer backgrinding
Wafer testing
Engineering
Taguchi methods
Wafer
Embedded Wafer Level Ball Grid Array
Mechanical engineering
Finite element method
Correction
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