RF‐MEMS switches on a printed circuit board platform

Purpose – The purpose of this paper is to present a new class of printed circuit board (PCB)‐based, radio frequency micro‐electro‐mechanical systems (RF‐MEMS) switches and to describe the packaging method and evaluate performance.Design/methodology/approach – Traditional PCB materials and processes were combined with photolithographic high‐density interconnect (HDI) and MEMS to form 3D high‐performance RF switches.Findings – A new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to those used for silicon MEMS, PCB, and HDI technologies were utilized to fabricate these 3D structures. The PCB‐based microstructures are “mil‐scale” rather than the “micro‐scale” of silicon MEMs. A co‐fabrication packaging method for the MEMS RF switch was also developed. The PCB‐based MEMS switches have demonstrated excellent RF performance and “hot‐switching” RF power‐handling capability. PCB‐based MEMS RF switches have the advantages of low cost and amenability to scale‐up for a high deg...