Creep Corrosion occurrence on TQFP IC package

Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people's daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also, Creep Corrosion is a big concern to Cloud Computing. In this study, creep corrosion occurrence on IC Package is investigated.