The photosensitive resin composition, and a photosensitive element using the same solder resist and the printed circuit board

(A) binder polymer, the (B) photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) a sensitizer, (B) component, the equation (1) a photopolymerizable compound, a photopolymerizable compound and a photosensitive resin composition containing a photopolymerizable compound, a having at least three ethylenically unsaturated bonds of the formula (2). [In formula (1), In the formula (2), X is a divalent organic group, ] [Formula 1] ## STR2 ##