A light emitting device package and a method of manufacturing the same

PURPOSE: A light-emitting device package and method of manufacturing the same are provided to improve an electric characteristic due to an electric contact between a YAG phosphor material and a light emitting device by forming a first molding part including a transparent insulating resin between the YAG phosphor material and the light emitting device. CONSTITUTION: A light-emitting device package includes a cap-shaped package structure, a light-emitting device, a first molding part, and a second molding part. A groove part is formed on a top side of the cap-shaped package structure(101). An electrode pattern(102) is formed on the top side of the groove part. The light-emitting device(104) is arranged on the groove part. The light-emitting device is connected to the electrode pattern in order to generate the blue light. The first molding part(107) is formed on the light-emitting device. The first molding part is formed with an insulating resin including an optical dispersion agent in order to disperse the light of the light-emitting device. The second molding part(109) is formed on the first molding part. The second molding part is formed with a YAG phosphor material in order to absorb partially wavelengths of the blue light.