Copper surface organic solder preservative and application thereof

The invention discloses copper surface organic solder preservative and an application thereof. The organic solder preservative comprises a solution containing organic film forming matter, an adjusting additive and a buffering agent; the organic film forming matter is an imidazole compound; the buffering agent is one or more of 2-amidogen-2-methyl-1-propyl alcohol, 2-(butyl amine) ethyl alcohol and N-methylethanolamine or is an aqueous solution of one or more of 2-amidogen-2-methyl-1-propyl alcohol, 2-(butyl amine) ethyl alcohol and N-methylethanolamine. According to the copper surface organic solder preservative, through formula improvement, the dissolving property of the film forming matter and stability of a reaction system can be improved, accordingly, the film forming quality of the copper surface is improved, and the film forming efficiency is improved.