LED point-like COB module and manufacturing method thereof

The invention discloses an LED point-like COB module. The LED point-like COB module comprises a substrate and a printed circuit layer. The substrate is provided with at least one LED luminous point which is internally provided with an LED luminescence chip, the external layer of each LED luminous point is coated by fluorescent glue, each LED luminescence chip is conducted with the printed circuit layer, and the printed circuit layer is provided with two electrodes. According to the manufacturing method of the LED point-like COB module, the printed circuit layer is arranged on the substrate through an electroplating or sintering mode, the substrate provided with the printed circuit layer is cleaned and dried, then, the LED luminescence chips are fixed on the arranged printed circuit layer through a baking fixing or reflow soldering mode, the fluorescent glue coats the surfaces of the LED luminescence chips through a dispensing mode, and braking fixation is carried out. The advantages are as follows: through such a scheme design, the LED luminescence chips and the substrate made of a high heat conduction material are directly compounded together, such that a support is omitted, an intermediate thermal resistance link is reduced, the heat dissipation problem of an LED can be improved quite well, and the service life of the LED is guaranteed.