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Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module
Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module
2017
C. Barbagallo
G L Malgioglio
G. Petrone
G. Cammarata
Keywords:
Soldering
Chip
Electronic engineering
Power module
Materials science
life evaluation
Mechanical engineering
thermal fatigue
Correction
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