Thermoformed film compositions with enhanced toughness after thermoforming processes

Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I 10 /I 2 ) that meets the following equation: I 10 /I 2 ≥ 7.0 - 1.2 x log (I 2 ).