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A Wafer-Level Burn-in Technology : Realization of Stable Contact Resistance for Al Bond Pads
A Wafer-Level Burn-in Technology : Realization of Stable Contact Resistance for Al Bond Pads
1999
Yoshiro Nakata
Keiichi Fujimoto
Shinichi Oki
Akio Watakabe
Keywords:
Nanotechnology
Wafer
Materials science
Contact resistance
Composite material
Burn-in
Bond
Correction
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