Light-emitting diode packaging structure
2015
The invention discloses a light-emitting diode packaging structure, which comprises a multilayer circuit board, a light-emitting diode wafer and a lens, wherein the multilayer circuit board comprises a conduction layer, a first resin layer arranged on the conduction layer and a first line layer arranged on the first resin layer; a first open hole is formed in the first resin layer; partial surface of the conduction layer is exposed outside via the first open hole to be defined as a die bond area; a second open hole is formed in the first line layer, and the die bond area is exposed outside via the second open hole; the light-emitting diode wafer is fixed on the die bond area and in routing connection with the first line layer; and the lens is arranged on the first resin layer and covers the light-emitting diode wafer and the first line layer.
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