A method for generating large-area solid layers

The invention relates to a method for producing at least one solid layer (1). The process comprises at least the steps of: Providing a carrier substrate (2) having a first exposed surface (4) and a second exposed surface (6); Generating a release layer (8) on the first exposed surface (4) of the carrier substrate (2), wherein the release layer (8) having an exposed surface (10); comprises generating the first solid layer (1) on the exposed surface (10) of the release layer (8), wherein the first solid layer (1) spaced one to the release layer (8) free surface (12); Disposing or forming a recording layer (14) on the second exposed surface (6) of the carrier substrate (2) or on the free surface (12) of the first solid layer (1); Generating voltages within the release layer (8), wherein the voltages are generated by a temperature of at least the recording layer (14), wherein inside the release layer (8) or in the border area (16) between the release layer (8) and the first solid layer (1) in consequence of stresses propagating a crack, wherein the first solid layer (1) is cleaved from the previously produced multilayer assembly by the crack.