Ag-Sn系の液相焼結現象を応用した高多層一括積層基板(PALAP)の開発

In order to construct the multi layers IVH (Interstitial Via Hole) structure with only one time hot pressing; we have developed the new diffusion bonding technology. The liquid phase sintering of Ag-Sn mixed powders (Ag/Sn:65/35 mass%) is utilized for bonding between Copper layers.In this paper, the pore formation at Ag and Ag-Sn sintering process was investigated, and the effect of Sn liquid phase on pore formation was discussed. However Ag formed Ag3Sn with the solid diffusion reaction up to 453 K, excess Sn particles exist surrounded with Ag3Sn. While Sn particles are fusible above 494 K, the shell of Ag3Sn is infusible. Pore forms with Sn particles effusion