Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board

A resin composition for a printed wiring board contains an inorganic filler and a resin component that contains a thermoset resin. The inorganic filler contains crushed silica measuring 0.1 m 2 /g-15 m 2 /g in specific surface area, and molybdenum compound particles having at least a molybdenum compound on the surface layer. The crushed silica content is 10-150 parts by mass to 100 parts by mass of the resin component.