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Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package
Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package
2020
Murayama Kei
Miki Shota
Sugahara Hiromi
Oi Kiyoshi
Keywords:
Interposer
Materials science
Nanotechnology
substrate
Correction
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