Necessity of characterizing hybrid microcircuit elements at microwave frequencies

As a result of efforts to develop packaging techniques for large radio frequency hybrid microcircuits (HMC), the need for characterization of such microcircuits became apparent. Characterization of hybrids and their manufacturing processes for radio frequency applications is required for economic production. Many of the present rf HMC circuits require extensive circuit adjustments to obtain desired function. The problems involved are partially the result of the lack of accurate rf characterization of the components and manufacturing processes as they relate to rf HMC applications.