The wafer carrier assembly layer composite for use in the production of such a wafer support assembly as well as corresponding methods and uses

The wafer carrier assembly comprising: - a wafer (8), - a support layer (4, 6) and - a release layer (2) disposed between the carrier layer (4, 6) and the wafer (8) is arranged, wherein the release layer (2) (I) a plasma polymer layer (2) is or comprises a layer adjacent to the backing layer plasma polymer layer (2) adjacent to one or more further layers, and (Ii) adhering to the wafer (8) and (4, 6) to the backing layer adheres more firmly than to the wafer, in which the plasma polymer layer (2) is a layer consisting of carbon, silicon, oxygen and hydrogen, in the ESCA spectrum of the plasma polymer layer (2), wherein calibration to the aliphatic portion of the C 1s peak at 285.00 eV, compared a trimethylsiloxy-terminated polydimethylsiloxane (PDMS) with a kinematic viscosity of 350 mm of Si 2 p peak has a bond energy value which is shifted by at most 0.44 eV to higher or lower binding energies, and the O 1s peak has a bond energy value which is shifted by at most 0.50 eV to higher or lower binding energies.