Semiconductor Technologies for next Generation Mobile Communications

In this work, we will address the opportunities and technology challenges related to next generation mobile communication. To enable the required data rates and reliability for 5G applications, Si CMOS will need to be complemented with new materials and device architectures like III-V or GaN devices to enable at the same time the targeted speed and power efficiency of these systems. Heterogeneous integration, either monolithic or using 3D integration, will be a key enabler to achieve this.