mems device substrate with a blanket

The present invention relates to a MEMS device which overlay substrate with which the dielectric layer is disposed on a first substrate, the dielectric layer having a recessed portion formed in the sacrificial therein. The integrated circuit further comprises a dielectric layer formed over and suspended above the recessed portion sacrificial layer, and a film is formed so as to engage a capping substrate second recess, the second recess portion is formed into a film by It is connected to the through hole in the sacrificial layer concave portion.